TechDebt 2023
Sun 14 - Mon 15 May 2023 Melbourne, Australia
co-located with ICSE 2023
Dates
Tracks
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Sun 14 May

Displayed time zone: Hobart change

11:00 - 12:30
Self-Admitted Technical DebtPlenary / Technical Papers / Short Papers at Meeting Room 101
11:00
25m
Research paper
An Exploratory Study on the Occurrence of Self-Admitted Technical Debt in Android Apps
Technical Papers
Gregory Wilder II University of Hawai‘i at Mānoa, Riley Miyamoto University of Hawai‘i at Mānoa, Samuel Watson University of Hawai‘i at Mānoa, Rick Kazman University of Hawai‘i at Mānoa, Anthony Peruma University of Hawai‘i at Mānoa
Pre-print
11:25
25m
Research paper
Automatically Identifying Relations Between Self-Admitted Technical Debt Across Different Sources
Technical Papers
Yikun Li University of Groningen, Mohamed Soliman University of Groningen, Paris Avgeriou Univ. of Gronningen 
11:50
15m
Short-paper
Automated Self-Admitted Technical Debt Tracking at Commit-Level: A Language-independent Approach
Short Papers
Mohammad Sadegh Sheikhaei School of Computing, Queen's University, Yuan Tian Queens University, Kingston, Canada
Pre-print
12:05
15m
Short-paper
Measuring Improvement of F1-Scores in Detection of Self-Admitted Technical Debt
Short Papers
William Aiken University of Ottawa, Paul K. Mvula University of Ottawa, Paula Branco University of Ottawa, Guy Jourdan University of Ottawa, Mehrdad Sabetzadeh University of Ottawa, Herna Viktor University of Ottawa
Pre-print
12:20
10m
Live Q&A
Open Q&A
Plenary

13:45 - 15:15
Technical Debt ManagementTechnical Papers / Plenary at Meeting Room 101
13:45
25m
Research paper
The Type to Take Out a Loan? A Study of Developer Personality and Technical Debt
Technical Papers
Lorenz Graf-Vlachy University of Stuttgart, Stefan Wagner University of Stuttgart
Pre-print
14:10
25m
Research paper
Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics
Technical Papers
Fandi Bi Technical University of Munich, Birgit Vogel-Heuser Karlsruhe Institute of Technology, Fengmin Du ETH Zürich, Nils Hanich Technical University of Munich, Eunnuri Cho Technical University of Munich
14:35
25m
Talk
How to introduce TD Management into a Software Development Process – A Practical Approach
Technical Papers
Markus Finke KUKA Deutschland, Thomas Neff KUKA Deutschland, Tobias Reichl KUKA Deutschland
15:00
15m
Live Q&A
Open Q&A
Plenary

15:45 - 17:15
Architecture and Documentation Technical DebtTechnical Papers / Plenary at Meeting Room 101
15:45
25m
Research paper
Identifying Code Changes for Architecture Decay via a Metric Forest Structure
Technical Papers
Wuxia Jin Xi'an Jiaotong University, Yuyun Zhang Xi'an Jiaotong University, Jiaowei Shang Xi'an Jiaotong University, Yi Hou Xi'an Jiaotong University, Ming Fan Xi'an Jiaotong University, Ting Liu Xi'an Jiaotong University
16:10
25m
Research paper
Resolving Security Issues via Quality-Oriented Refactoring: A User Study
Technical Papers
Domenico Gigante SER&Practices and University of Bari, Fabiano Pecorelli Jheronimus Academy of Data Science, Vita Santa Barletta University of Bari, Andrea Janes FHV Vorarlberg University of Applied Sciences, Valentina Lenarduzzi University of Oulu, Davide Taibi Tampere University , Maria Teresa Baldassarre Department of Computer Science, University of Bari
16:35
25m
Research paper
Towards identifying and minimizing customer-facing documentation debt
Technical Papers
Lakmal Silva Blekinge Institute of Technology, Michael Unterkalmsteiner Blekinge Institute of Technology, Krzysztof Wnuk
17:00
15m
Live Q&A
Open Q&A
Plenary

Mon 15 May

Displayed time zone: Hobart change

11:00 - 12:30
Maintenance of Technical DebtPlenary / Technical Papers at Meeting Room 101
11:00
25m
Research paper
Technical Debt Classification in Issue Trackers using Natural Language Processing based on Transformers
Technical Papers
Daniel Skryseth University of Oslo, Karthik Shivashankar University of Oslo, Ildikó Pilán Norwegian Computing Center, Antonio Martini University of Oslo, Norway
11:25
25m
Research paper
Exploring the Effect of Various Maintenance Activities on the Accumulation of TD Principal
Technical Papers
Nikolaos Nikolaidis University of Macedonia, Apostolos Ampatzoglou University of Macedonia, Alexander Chatzigeorgiou University of Macedonia, Nikolaos Mittas International Hellenic University, Evdokimos Konstantinidis Aristotle University, Panagiotis Bamidis Aristotle University
11:50
40m
Live Q&A
Open Q&A
Plenary

Accepted Papers

Title
An Exploratory Study on the Occurrence of Self-Admitted Technical Debt in Android Apps
Technical Papers
Pre-print
Automatically Identifying Relations Between Self-Admitted Technical Debt Across Different Sources
Technical Papers
Exploring the Effect of Various Maintenance Activities on the Accumulation of TD Principal
Technical Papers
How to introduce TD Management into a Software Development Process – A Practical Approach
Technical Papers
Identifying Code Changes for Architecture Decay via a Metric Forest Structure
Technical Papers
Resolving Security Issues via Quality-Oriented Refactoring: A User Study
Technical Papers
Technical Debt Classification in Issue Trackers using Natural Language Processing based on Transformers
Technical Papers
Technical Debt Contagiousness Metrics for Measurement and Prioritization in Mechatronics
Technical Papers
The Type to Take Out a Loan? A Study of Developer Personality and Technical Debt
Technical Papers
Pre-print
Towards identifying and minimizing customer-facing documentation debt
Technical Papers

Call for Papers

We invite submissions of papers to the Technical Track in any areas related to the theme and goal of the conference in the following categories:

  • Research Papers (up to 10 pages): innovative and significant original research in the field
  • Experience Papers (up to 10 pages): experience, case studies, challenges, problems, and solutions drawn from the application of technical debt tools and techniques in the industrial context.

If you would like to submit a tool demo or description of a tool (either to complement your submission to the Technical Track or as a separate submission), or early research achievements, please refer to the Short Paper Track of TechDebt 2023.

Submissions must be original and unpublished work. Each paper submitted to the main Technical Track will undergo a rigorous review process by at least three members of the program committee.

TechDebt 2023 is using a doubly anonymous reviewing model for the Technical Track (only). Therefore, all submissions to this track have to fulfill the doubly-anonymous reviewing requirements (refer to the ICSE Q&A for more details). Any submission that does not comply with these requirements may be desk-rejected without further review.

Evaluation criteria:

  • Relevance: Submission must respond to Call for Papers.
  • Novelty: Is there sufficient originality in the contribution, and is it clearly and correctly explained with respect to the state of the art?
  • Soundness: Are all claimed contributions supported by the rigorous application of appropriate research methods? Claims should be scoped to what can be supported, and limitations should be discussed.
  • Significance: Are contributions evaluated for their importance and impact with respect to the existing body of knowledge? The authors are expected to explicitly argue for the relevance and usefulness of the research and discuss the novelty of the claimed contributions through a comparison with pertinent related work.
  • Replicability: Is there sufficient information in the paper for the results to be independently replicated? The evaluation of submissions will take into account the extent to which sufficient information is available to support the full or partial independent replication of the claimed findings.
  • Presentation Quality: Are results clearly presented? Submissions are expected to meet high standards of presentation, including adequate use of the English language, absence of major ambiguity, clearly readable figures and tables, and respect of the formatting instructions.

The weighting and relevance of the above criteria vary for paper types.

Openness in science is key to fostering progress via transparency, reproducibility and replicability. While all submissions will undergo the same review process independent of whether or not they disclose their analysis code or data, we strongly encourage authors to make data available upon submission (either privately or publicly) and especially upon acceptance (publicly). If the authors cannot disclose industrial or otherwise non-public data, they should provide an explicit (short) statement in the paper.

Papers must be submitted electronically via the TechDebtConf2023 HotCRP site. Submissions must be in PDF and conform to the IEEE formatting guidelines applied for ICSE 2023. Submissions may not exceed the number of pages specified above (including all text, references, and figures). Purchase of additional pages in the proceedings is not allowed.

Formatting instructions are available for both LaTeX and Word users at: https://www.ieee.org/conferences/publishing/templates.html ((title in 24pt font and full text in 10pt type, LaTeX users must use \documentclass[10pt,conference]{IEEEtran} without including the compsoc or compsocconf options).

Submissions are via HotCRP: https://techdebt2023.hotcrp.com/

The official publication date is the date the proceedings are made available in the ACM or IEEE Digital Libraries. This date may be up to two weeks prior to the first day of TechDebt 2023. The official publication date affects the deadline for any patent filings related to published work.

A selection of the best papers will be invited to submit extended versions for tentative publication in a Special Section of the journal of Empirical Software Engineering published by Springer. The best papers of the research track will be awarded an ACM SIGSOFT Distinguished Paper Award at TechDebt 2023.